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Gigabyte B660M DS3H AX DDR4 Intel LGA 1700 mATX Motherboard


Gigabyte B660M DS3H AX DDR4 Intel LGA 1700 mATX Motherboard, 4x DDR4 ~128GB, 1x PCI-E x16, 2x PCI-E x1, 2x M.2, 4x SATA, 1x USB-C, 3x USB 3.2, 2x USB,
$252.00 inc GST      
■ Our stockin-stock
■ Supplier's stock11
■ BrandGigabyte
■ Part #B660M DS3H AX DDR4
Gigabyte B660M DS3H AX DDR4 Intel LGA 1700 mATX Motherboard, 4x DDR4 ~128GB, 1x PCI-E x16, 2x PCI-E x1, 2x M.2, 4x SATA, 1x USB-C, 3x USB 3.2, 2x USB,
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Product Information

  • CPU
    1. LGA1700 socket: Support for 12th Generation Intel® Core™, Pentium® Gold and Celeron® Processors*
    2. L3 cache varies with CPU
    * Please refer to "CPU Support List" for more information.
  • Chipset
    1. Intel® B660 Express Chipset
  • Memory
    1. Support for DDR4 5333(O.C.)/ DDR4 5133(O.C.)/DDR4 5000(O.C.)/4933(O.C.)/4800(O.C.)/ 4700(O.C.)/ 4600(O.C.)/ 4500(O.C.)/ 4400(O.C.)/ 4300(O.C.)/4266(O.C.) / 4133(O.C.) / 4000(O.C.) / 3866(O.C.) / 3800(O.C.) / 3733(O.C.) / 3666(O.C.) / 3600(O.C.) / 3466(O.C.) / 3400(O.C.) / 3333(O.C.) / 3300(O.C.) / 3200/3000/2933/2666/2400/2133 MHz memory modules
    2. 4 x DDR DIMM sockets supporting up to 128 GB (32 GB single DIMM capacity) of system memory
    3. Dual channel memory architecture
    4. Support for ECC Un-buffered DIMM 1Rx8/2Rx8 memory modules (operate in non-ECC mode)
    5. Support for non-ECC Un-buffered DIMM 1Rx8/2Rx8/1Rx16 memory modules
    6. Support for Extreme Memory Profile (XMP) memory modules
    (Please refer "Memory Support List" for more information.)
  • Onboard Graphics
    Integrated Graphics Processor-Intel® HD Graphics support:
    1. 1 x HDMI port, supporting a maximum resolution of 4096x2160@60 Hz
      * Support for HDMI 2.1 version and HDCP 2.3.
      ** Support native HDMI 2.1 TMDS compatible ports.
    2. 1 x DisplayPort, supporting a maximum resolution of 4096x2304@60 Hz
      * Support for DisplayPort 1.2 version and HDCP 2.3
    3. 1 x DisplayPort, supporting a maximum resolution of 4096x2304@60 Hz
      * Support for DisplayPort 1.2 version.
    (Graphics specifications may vary depending on CPU support.)

    Support for up to 3 displays at the same time
  • Audio
    1. Realtek® Audio CODEC
    2. High Definition Audio
    3. 2/4/5.1/7.1-channel
      * To configure 7.1-channel audio, you need to open the audio software and select Device advanced settings > Playback Device to change the default setting first.
  • LAN
    1. Realtek® 2.5GbE LAN chip (2.5 Gbps/1 Gbps/100 Mbps)
  • Wireless Communication module
    Intel® Wi-Fi 6 AX201 (For PCB rev. 1.0)
    1. WIFI a, b, g, n, ac, ax, supporting 2.4/5 GHz Dual-Band
    2. BLUETOOTH 5.2
    3. Support for 11ax 160MHz wireless standard and up to 2.4 Gbps data rate
    Intel® Wi-Fi 6 AX200 (For PCB rev. 1.1)
    1. WIFI a, b, g, n, ac, ax, supporting 2.4/5 GHz Dual-Band
    2. BLUETOOTH 5.2
    3. Support for 11ax 160MHz wireless standard and up to 2.4 Gbps data rate
    Intel® Wi-Fi 6E AX211 (For PCB rev. 1.2)
    1. WIFI a, b, g, n, ac, ax, supporting 2.4/5/6 GHz carrier frequency bands
    2. BLUETOOTH 5.2
    3. Support for 11ax 160MHz wireless standard and up to 2.4 Gbps data rate
    (Actual data rate may vary depending on environment and equipment.)
  • Expansion Slots
    1. 1 x PCI Express x16 slot, running at x16
      (The PCIEX16 slot conforms to PCI Express 4.0 standard.)
    2. 2 x PCI Express x1 slots
      (The PCIEX1 slots conform to PCI Express 3.0 standard.)
  • Storage Interface
    CPU:
    1. 1 x M.2 connector (Socket 3, M key, type 2260/2280 PCIe 4.0 x4/x2 SSD support) (M2A_CPU)
    Chipset:
    1. 1 x M.2 connector (Socket 3, M key, type 2260/2280 PCIe 4.0 x4/x2 SSD support) (M2P_SB)
    2. 4 x SATA 6Gb/s connectors
    Support for RAID 0, RAID 1, RAID 5, and RAID 10

    Intel® Optane™ Memory Ready
    * System acceleration with Intel® Optane™ Memory can only be enabled on the M.2 connector supported by the Chipset.
  • USB
    Chipset:
    1. 1 x USB Type-C® port on the back panel, with USB 3.2 Gen 2 support
    2. 5 x USB 3.2 Gen 1 ports (3 ports on the back panel, 2 ports available through the internal USB header)
    3. 2 x USB 2.0/1.1 ports on the back panel
    Chipset+2 USB 2.0 Hubs:
    1. 4 x USB 2.0/1.1 ports available through the internal USB headers
  • Internal I/O Connectors
    1. 1 x 24-pin ATX main power connector
    2. 1 x 8-pin ATX 12V power connector
    3. 1 x CPU fan header
    4. 3 x system fan headers
    5. 1 x addressable LED strip header
    6. 1 x RGB LED strip header
    7. 2 x M.2 Socket 3 connectors
    8. 4 x SATA 6Gb/s connectors
    9. 1 x front panel header
    10. 1 x front panel audio header
    11. 1 x USB 3.2 Gen 1 header
    12. 2 x USB 2.0/1.1 headers
    13. 1 x Trusted Platform Module header (For the GC-TPM2.0 SPI/GC-TPM2.0 SPI 2.0 module only)
    14. 1 x S/PDIF Out header
    15. 1 x Q-Flash Plus button
    16. 1 x reset button
    17. 1 x reset jumper
    18. 1 x Clear CMOS jumper
    *All fan headers are subject to support AIO_Pump, Pump and high performance fan with the capability of delivering up to 2A/12V @ 24W.
  • Back Panel Connectors
    1. 2 x USB 2.0/1.1 ports
    2. 1 x PS/2 keyboard/mouse port
    3. 2 x SMA antenna connectors (2T2R)
    4. 1 x HDMI port
    5. 2 x DisplayPorts
    6. 3 x USB 3.2 Gen 1 ports
    7. 1 x USB Type-C® port, with USB 3.2 Gen 2 support
    8. 1 x RJ-45 port
    9. 3 x audio jacks
  • I/O Controller
    1. iTE® I/O Controller Chip
2 years warranty return to retailer.
Please also visit A.C.O Warranty Policy and Terms & Conditions.
 
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